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Sreevatsan Radhakrishnan's avatar

Would love to hear more about recent progresses on 3D interconnects (more products in market recently) and the effects it has on reimagining design - integration - packaging co-optimisation. This actually requires to go for System first approach, model down to every interconnects for power, performance (latency limiter) and reliability.

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Vikram Sekar's avatar

I have some notes from that part of the conference. I need to really sit down and write about it.

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SEMI VISION's avatar

Good event

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Maxx Yung's avatar

Thank you for distilling the talks for people who couldn't make it! Looking forward to that future post.

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