Packaging

Why is High Bandwidth Memory so Hard to Manufacture?

An in-depth look into the incredible engineering behind the memory used in GPUs for AI accelerators.

2 hrs ago •

The Manufacturing Challenge Behind Nvidia’s Plan to Mount AI Chips Directly on PCB Platforms

Is substrate-like PCB technology sufficiently ready to replace ABF substrates that are ubiquitous in AI chips today?

Aug 17 •

A Comprehensive Primer on Advanced Semiconductor Packaging

Almost everything you will ever need to know about semiconductor packaging.

Jun 1 •

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