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Why Faster PHY Design is the Low-Hanging Fruit in Custom HBM4 Base Die
A deep dive into HBM’s base die: covering DRAM structure, PHY functions, and how advanced interconnects like UCIe and next-gen PHYs from Marvell and…
18 hrs ago
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Vikram Sekar
15
2
How AI Demand Is Driving a Multi-Year Memory Supercycle
AI's insatiable hunger for HBM, DRAM, NAND and even DDR4 is reshaping the memory market.
Oct 1
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Vikram Sekar
33
17
September 2025
Nvidia Buys Into Intel, Apple’s Modem, Corporate Jobs, and the Billion-Dollar Cable Race
A few articles I really enjoyed, round up of all my content from September, and a short quiz.
Sep 24
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Vikram Sekar
17
2
High Bandwidth Flash: NAND’s Bid for AI Memory
Can HBF be a new memory tier for AI workloads? Where its limits will show, and what are use-cases for a high capacity memory thats slower than HBM or…
Sep 21
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Vikram Sekar
22
4
The Hidden Art Inside Your Microchips
How engineers, artists, and musicians turned microchips into a canvas for human creativity.
Sep 17
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Sam Iyer
and
Vikram Sekar
11
Plastic Cables for AI Clusters: Can Point2’s E-Tube Disrupt Copper and Optics?
A deep dive into dielectric waveguides, the company behind them, performance compared to copper and optics, and whether hyperscalers will actually adopt…
Sep 14
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Vikram Sekar
25
6
My 100th Post and a New Experiment
100 shots on goal, evolution of my writing, and a new project.
Sep 10
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Vikram Sekar
18
A Beginner’s Guide to Interconnects in AI Datacenters
Understanding performance and trade-offs shaping interconnect choices in AI datacenters.
Sep 8
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Vikram Sekar
43
Why Documentation is the Missing Link Between AI and Chip Design
Chip design has always depended on unwritten know-how. To bridge tribal knowledge and machine intelligence, engineering culture needs new ways to…
Sep 3
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Vikram Sekar
18
6
August 2025
Why is High Bandwidth Memory so Hard to Manufacture?
An in-depth look into the incredible engineering behind the memory used in GPUs for AI accelerators.
Aug 31
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Vikram Sekar
52
1
What Chip Design Can Learn from Supersonic Jets
Lessons from Boom Supersonic’s engineering culture and what they mean for the future of chip design.
Aug 20
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Vikram Sekar
41
21
The Manufacturing Challenge Behind Nvidia’s Plan to Mount AI Chips Directly on PCB Platforms
Is substrate-like PCB technology sufficiently ready to replace ABF substrates that are ubiquitous in AI chips today?
Aug 17
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Vikram Sekar
21
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