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Qualcomm's High Bandwidth Compute and the Packaging Problem It Moved
HBC stacking DRAM on the compute die increases memory bandwidth and skips CoWoS. The packaging problem does not go away, it shifts to 3D.
Jul 1
•
Vikram Sekar
39
1
2
June 2026
🍪 TWiC: Jalapeno, Modular, and Gatekeeping of Frontier Models
Its all about inference these days, by a long shot.
Jun 27
•
Vikram Sekar
22
4
2
What AI Inference Actually Demands From a NAND SSD
KV cache storage is a distinct workload that requires SSDs designed for it. Number of cell levels, block sizes, and data placements all matter, and some…
Jun 25
•
Vikram Sekar
28
🍪 TWiC: AMD-MEXT, 200G VCSELs, INTC 🚀
Scattered thoughts across memory, optics, and business.
Jun 19
•
Vikram Sekar
34
3
1
Battle for Advanced Packaging: TSMC Monopoly, Intel Challenge, and Amkor Arms-Dealing
Intel’s advanced packaging business is now a credible source of supply for the AI accelerator industry, while TSMC keeps ramping. Amkor plays both…
Jun 17
•
Vikram Sekar
51
1
6
🍪 TWiC: Controversial Packaged Optics
Developing an appreciation for engineering challenges in CPO deployment.
Jun 12
•
Vikram Sekar
38
1
4
Computex 2026 Debrief
I've never been to a show as big as this.
Jun 7
•
Vikram Sekar
49
4
4
May 2026
🍪 TWiC: What Light Source Does CPO Really Need?
A stream-of-consciousness approach to understanding UHP vs CW-WDM laser sources.
May 29
•
Vikram Sekar
31
1
2
Huawei's Tau Scaling Is Really a Hybrid Bonding Bet
Tau Scaling is just extreme co-design and a hybrid bonding bet. The same “workaround” on a leading-edge node only widens the lead for those with EUV.
May 27
•
Vikram Sekar
36
2
How Rack Power Density Is Opening a New Market for Active Copper
As AI racks grow too dense to power and cool, their scale-up networks spread across cabinets, and the short links in between are where active copper…
May 25
•
Vikram Sekar
59
5
🍪 TWiC: What's Up With Orbital Compute?
Gavin Baker made some interesting points, and I thought through some market opportunities.
May 22
•
Vikram Sekar
47
3
5
Inside SambaNova's Inference Architecture
How the Three-Tier Memory Hierarchy and the Reconfigurable Dataflow Unit Compare to Rubin, Groq, and Cerebras
May 20
•
Vikram Sekar
33
5
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