Vik’s Research Library

>200 published posts across 2024–2026.

Semiconductor technology, explained from first principles. Organized for reference.

Welcome to the research library for Vik’s Newsletter.

Since launching this newsletter, I’ve written about everything from RF transistor noise and transmission lines to AI accelerators, high-bandwidth memory, semiconductor lasers, advanced packaging, and the infrastructure needed to power AI datacenters.

The common theme is engineering: understanding the physical constraints behind technology choices, the trade-offs involved, and what those choices mean for the companies building the technology.

This library organizes my work by year and provides selected reading paths that connect articles across multiple years.

The goal is to make the newsletter more useful as a technical reference, rather than a collection of posts buried in your inbox.

Browse the Annual Libraries

2026 — AI Hardware and Infrastructure

73 published posts through November 13, 2026

The latest research focuses on AI compute architectures, HBM, optical networking, advanced packaging, datacenter power delivery, and the companies developing these technologies.

Explore the 2026 Research Library

2025 — Semiconductor Foundations and AI Architectures

81 published posts

A year of expanding coverage into semiconductor devices, AI inference, memory, chip manufacturing, silicon photonics, high-voltage power delivery, and engineering tools.

Explore the 2025 Research Library

2024 — RF Engineering and the Origins of the Newsletter

47 published posts

The original technical foundation of the newsletter: RF circuit design, power amplifiers, semiconductor modeling, antennas, automotive radar, LiDAR, wireless communications, and the beginnings of broader semiconductor coverage.

Explore the 2024 Research Library


Recommended Reading Paths

For readers who want to go deeper into a subject, I’ve put together a few sequences of articles that build on one another.

1. Semiconductor Physics, Manufacturing, and Advanced Packaging

Start with fundamental device and manufacturing concepts, then progress into advanced packaging and the competitive implications of manufacturing technology.

  1. How Foundries Calculate Die Yield — 2024

  2. How Dennard Scaling Allowed Transistors to Shrink — 2025

  3. A Comprehensive Primer on Advanced Semiconductor Packaging — 2025

  4. Battle for Advanced Packaging: TSMC, Intel, and Amkor — 2026

2. RF Circuit Design and Engineering Fundamentals

A collection for engineers who want to build stronger foundations in RF design, measurement, transistor modeling, and circuit behavior.

  1. Absolute Basics of Transmission Line Theory — 2024

  2. Understanding Two Port Amplifier Power Gains — 2024

  3. A Guide to Noise Sources in MOS Transistors — 2024

  4. The Ultimate Guide to Accurate RFIC Simulations — 2024

  5. Why 50 Ohms Became the RF Standard — 2025

3. HBM and the AI Memory Hierarchy

Understand why HBM is difficult to manufacture, how its architecture is evolving, and why custom base dies may change the competitive landscape.

  1. Why Is High Bandwidth Memory So Hard to Manufacture? — 2025

  2. Why Faster PHY Design Matters in Custom HBM4 Base Dies — 2025

  3. HBM Is the Ugly Baby: What Now? — 2026

  4. How Custom Base Die Drives HBM Bandwidth — 2026

4. Optical Networking and Semiconductor Lasers

Begin with the device physics behind semiconductor lasers, then progress into optical integration and AI networking architectures.

  1. Why We Can’t Build Lasers on Silicon — 2024

  2. The Silicon Photonics Moonshot: Group IV Integrated Lasers — 2025

  3. Why Co-Packaged Optics Uses External Lasers — 2025

  4. Lasers for CPO/NPO: Part 1 — The InP DFB Laser — 2026

  5. Lasers for CPO/NPO: Part 2 — Lumentum’s Technology and Moat — 2026

  6. Lasers for CPO/NPO: Part 3 — Master Oscillator, Power Amplifier — 2026

5. AI Datacenter Interconnects

Understand the architectures connecting AI accelerators, from electrical transmission to optical switching and next-generation high-speed links.

  1. A Beginner’s Guide to Interconnects in AI Datacenters — 2025

  2. A Complete Guide to Optical Transceiver Nomenclature — 2025

  3. How Rack Power Density Is Opening a Market for Active Copper — 2026

  4. The PAM4 vs. PAM6 Dilemma for 448G Copper Interconnects — 2026

6. AI Inference and Compute Hardware

Follow the relationship between model architecture, memory systems, compute hardware, and changing CPU requirements.

  1. A Primer on Transformer Architecture — 2025

  2. How d-Matrix’s In-Memory Compute Tackles AI Inference Economics — 2025

  3. The CPU Bottleneck in Agentic AI — 2026

  4. Inside SambaNova’s Inference Architecture — 2026

7. Power Delivery and Power Semiconductors

Understand how electrical efficiency and physical power-delivery limitations determine system architecture.

  1. Understanding How Electric Vehicles Convert Battery Power Into Propulsion — 2024

  2. The Rise of 800V Electric Vehicles and Role of Silicon Carbide — 2025

  3. Understanding High-Voltage DC Power Architectures for AI Megafactories — 2025

  4. Power Delivery As The Next Physics Wall In AI Datacenters — 2026

  5. 800VDC: Mapping the Power Semiconductor Space — 2026

The EV and datacenter applications differ, but both illustrate why voltage level, switching-device selection, and conversion architecture matter.

8. Automotive Radar and Sensing

A complete introductory sequence covering automotive radar operation, followed by a comparison of sensing technologies.

  1. How Automotive Radar Uses Chirp Signals for Sensing — 2024

  2. How Automotive Radar Measures the Velocity of Objects — 2024

  3. How Automotive Radar Measures the Angle of Arrival of Objects — 2024

  4. Exploring State-of-the-Art Commercial Automotive Radar Solutions — 2024

  5. A Short Introduction to Automotive LiDAR Technology — 2024


How to Use the Library

Each annual library contains a more complete thematic index of the research published during that year.

The reading paths on this page are curated sequences for learning a subject, understanding its engineering trade-offs, and following the evolution of technology across several years.

Historical articles retain their original publication dates. Industry forecasts, company assessments, and technology roadmaps should be interpreted using the information available at the time they were written.

I hope this library makes it easier to find something useful, whether you’re working on a semiconductor design problem, studying an unfamiliar technology, or trying to understand what a new architecture means for the industry.

Engineer first. Analyst later.

Thank you for supporting Vik’s Newsletter.

Browse the complete chronological archive

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Vik’s Newsletter is built around a simple idea: understand the engineering first, then follow the implications for technology and industry.

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Over >200 posts published across 2024–2026, organized to help you find the research you need.

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